PCB Capabilities
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Home > PCB Capabilities

PCB Capabilities

No.

Item

Capability

Details

1

Layer

1-8 layer

1-8 layer PCB prototypes

2

Ink

TAIYO

White: TAIYO 2000 series Green: TAIYO 07 series

3

Material

FR-4

FR-4 material only (KB6160A TG130)

4

Max. Dimension

550x650mm

Standard dimension is 550*650mm

5

Dimension Tolerance(Outline)

±0.15mm

±0.15mm for CNC routing, and ±0.5mm for V-scoring

6

Thickness

0.4--3.0mm

0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0mm

7

Thickness Tolerance( t≥1.0mm)

± 10%

+10% will occur for the technologies like electroless copper, solder mask and pad plating.

8

Thickness Tolerance( t<1.0mm)

±0.1mm

+0.1mm will occur for the technologies like electroless copper, solder mask and pad plating.

9

Min. Trace

4mil(0.1mm)

Min. trace is 4 mil. More than 6 mil is recommended to save cost.

10

Min. Spacing

4mil(0.1mm)

Min. spacing is 4 mil. More than 6 mil is recommended to save cost.

11

Finished Outlayer Copper

35um/75um(1 OZ/2 OZ)

Also known as copper weight. 35μm=1oz, 70μm=2oz

12

Finished Inerlayer Copper

35um

35μm=1oz

13

Drill Size

0.25--6.3mm

Min. drill size is 0.25mm, Max. drill size is 6.3mm. Any holes greater than 6.3mm will charge extra fee.

14

Annular Ring

≥0.153mm(6mil)

Annular ring surrounded by traces should be equal to or larger than 0.153mm(6mil).

15

Finished Hole Size

0.25--6.5mm

For the plated hole wall, the finished hole size is smaller than the one in file.

16

Hole Size Tolerance

±0.075mm

eg. For the 0.6mm hole, the finished hole size between 0.525mm to 0.675mm is acceptable.

17

Solder Mask

LPI

Liquid Photo-Imageable Solder Mask

18

Min. Character Width

≥0.15mm

Characters width less than 0.15mm will be unidentifiable.

19

Min. Character Height

≥0.8mm

Characters height less than 0.8mm will be unidentifiable.

20

Character Width to Height Ratio

1:5

1:5 is the best ratio for producation.

21

Trace to Outline

≥0.3mm(12mil)

Rounting: Trace to Outline≥0.3mm; V-scoring: Trace to Outline

22

Panelization without space

0

For V-scoring panelization, set the space between boards to be 0.

23

Panelization with space

1.6mm

For Rounting panelization,set the space between boards to be ≥1.6mm.

24

Polygon Pour with Pads

Hatch

Please attention that we will apply Hatch to do Polygon Pour if your PCBs designed with Pads.

25

Slot Drawing with Pads

Drill Drawing Layer

With many unplated grooves, please draw them in Drill Drawing Layer.

26

Protel/dxp Override Layer

Solder Layer

Do not mistake the Paste Layer as Solder Layer.

27

Protel/dxp Keepout Layer

Keepout Layer/Mechanical Layer

Choose one from Keepout Layer or Mechanical Layer as outline.

28

Min. Half Hole Diameter

0.6mm

Half hole is a special technology, so half hole diameter should be greater than 0.6mm.

29

Soldermask Bridge

0.1mm

Solderbridge is available but it will charge extra fee.