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Some Commen PCB Terms-B
Jun 25, 2018
B-Stage ResinAlso called Prepreg. The condition of the fiberglass material used on multi-layer PCBs that is placed between the core layers of the board.  It is still pliable and soft until it is heated and pressed in a lamination press.  The heat causes the material to “flow” and then it will harden as it cools.

Bare Board

A completed printed circuit board prior to any components being placed on it.
BarrelA drilled hole can be either plated or unplated. The walls of a plated hole are called the hole barrel.  This creates a connection between the top of the board, the inner layers (if present) and the bottom of the board.
Bed of Nails A Bed of Nails is used as part of an Electrical Test for a PCB.  A frame is made that will hold test pins that match up with the connection points on the circuit board.  An electrical charge is applied to check for opens and shorts to provide a pass or fail for the board.  This method is not used very often; Flying Probe is the typical test method.
Beveled Edge A beveled edge is typically used to make the leading edge of a circuit board more pointed so that it can be inserted into a connecting device.  The standard is a 30 degree bevel.  An example would be a PCI card that is inserted into a PCI slot in a PC. 
Black PadBlack pad can happen on PCBs that have an Immersion Gold Finish (ENIG).  It is a condition where a surface mount component soldered to a PCB loses connection.  The nickel under the gold becomes corroded and creates a break in the connection.
Blind ViasBlind Vias are used in multi-layer boards where a drilled hole needs a connection from an outer layer to an inner layer where the hole must stop before the opposite outer layer. 
Blister A blister will appear in a localized section of the board when a separation between either the board material or between the material and any copper foil occurs. This may or may not cause a failure in the board depending on the location and is considered a form of delamination. 
Board ThicknessUsually referring to the final thickness of the printed circuit board.  This would include the fiberglass, soldermask and silkscreen and the board finish.  The most commonly used thickness is 0.062″ but many options are available
Body GoldBody Gold indicates that the full body of the board is plated gold. This may occur during either electro plating or immersion depending on the design. 
Border AreaPrinted circuit boards are manufactured on a larger panel and then individually routed out.  That production panel has a border area in order to allow for tooling holes and room for mounting to equipment during the manufacturing process.  Typically that boarder area is one inch on all sides.
BowBow references the flatness of a printed circuit board.  In the case of a bow all four corners of the board would be able to touch a flat surface equally but the middle area of the board would not be touching.
Buried ViasBuried Vias are used in multi-layer boards where inner layers need a connection but the drilled hole is on the inner layers only and does not extend to the outer layers. 
BurrWhen drilling a PCB there is often a ridge or piece of material that is left connected to the drilled hole.  The burr will need to be removed to not cause any problems in the rest of the manufacturing process.

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