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printed circuit board fabrication

Printed circuit board fabrication is the assembly method for circuit boards used in electronic and computer devices. The layers of the board are combined with specific surface patterns and can be used in electronic manufacturing.

Basic Info

Printed circuit board fabrication is the assembly method for circuit boards used in electronic and computer devices. The layers of the board are combined with specific surface patterns and can be used in electronic manufacturing.


Construction

Aluminum PCB fabrication is one of metal-based Printed circuit board fabrication, including copper foil, thermal insulating layer and metal substrate, its structure divide into three layers:

1. Circuit layer: the equivalent of an ordinary PCB, copper thickness from 1oz to 10oz.

2. Insulation layer: Insulation is a layer of thermal insulating material with low thermal resistance. Thickness: 0.003 "to 0.006" inch is the aluminum PCB core technology.

3. Based Layer: in printed circuit board fabrication, a metal substrate, usually aluminum or copper may be chosen.


Substrate performance

(1) Thermal dissipation

Common PCB substrates, such as FR4, CEM3 are poor conductors of thermal. If the heat of electronic equipments cannot be distributed in time, it will result in high temperature failure of electronic components. Aluminum substrates can solve this thermal dissipation problem.

(2) Thermal expansion

Aluminum substrate PCB can effectively solve the thermal dissipation problem, so that the thermal expansion and contraction problem of components on printed circuit boards with different substances can be alleviated, which improves the durability and reliability of whole machine and electronic equipments. In particular, it can solve the SMT (surface mount technology) thermal expansion and contraction problems.

(3) Dimensional stability

Aluminum substrate printed circuit board has apparently higher stability than the insulating material of the printed circuit board. When heated from 30 ° C to 140 ~ 150 ° C, the dimensional change of aluminum substrate is only 2.5 ~ 3.0%.

(4) Other performance

Aluminum substrate printed circuit board has shielded effect, and can alternative brittle ceramic substrate. It also helps to improve the heat resistance and physical properties and reduce production costs and labor.

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