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printed circuit board fabrication

Aluminum PCB is a unique metal-based copper clad laminate, which has good thermal conductivity, electrical insulation and machining performance. PCBonestop is good at printed circuit board fabrication, including aluminum PCB circuit board. The PCB fabrication service in PCBonestop is of high quality and customized.

Aluminum PCB is one of metal-based PCB, including copper foil, thermal insulating layer and metal substrate, its structure divide into three layers: 

1. Circuit layer: the equivalent of an ordinary PCB, copper thickness from 1oz to 10oz. 

2. Insulation layer: Insulation is a layer of thermal insulating material with low thermal resistance. Thickness: 0.003 "to 0.006" inch is the aluminum PCB core technology. 

3. Based Layer: a metal substrate, usually aluminum or copper may be chosen.

Aluminum substrate performance

(1) Thermal dissipation

Common PCB substrates, such as FR4, CEM3 are poor conductors of thermal. If the heat of electronic equipments cannot be distributed in time, it will result in high temperature failure of electronic components. Aluminum substrates can solve this thermal dissipation problem.

(2) Thermal expansion

Aluminum substrate PCB can effectively solve the thermal dissipation problem, so that the thermal expansion and contraction problem of components on printed circuit boards with different substances can be alleviated, which improves the durability and reliability of whole machine and electronic equipments. In particular, it can solve the SMT (surface mount technology) thermal expansion and contraction problems.

(3) Dimensional stability

Aluminum substrate printed circuit board has apparently higher stability than the insulating material of the printed circuit board. When heated from 30 ° C to 140 ~ 150 ° C, the dimensional change of aluminum substrate is only 2.5 ~ 3.0%.

(4) Other performance

Aluminum substrate printed circuit board has shielding effect, and can alternative brittle ceramic substrate. It also helps to improve the heat resistance and physical properties and reduce production costs and labor.